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description thesefprecisionfopticalfperformancefovalfledsfarefspecif - callyfdesignedfforffullfcolor/videofandfpassengerfinforma - tionf signs.f f thef ovalf shapedf radiationf patternf andf highf luminousfintensityfensurefthatfthesefdevicesfarefexcellentf forfwideffeldfoffviewfoutdoorfapplicationsfwherefafwidef viewingf anglef andf readabilityf inf sunlightf aref essential.ff thesef lampsf havef veryf smooth,f matchedf radiationf pat - ternsfensuringfconsistentfcolorfmixingfinffullfcolorfapplica - tions,fmessagefuniformityfacrossfthefviewingfanglefoffthef sign.ffhighfefciencyfledfmaterialfisfusedfinftheseflamps:f aluminumfindiumfgalliumfphosphidef(alingapfii)fforfredf andfindiumfgalliumfnitridefforfbluefandfgreen.ffeachflampf isf madef withf anf advancedf opticalf gradef epoxyf oferingf superiorf highf temperaturef andf highf moisturef resistancef infoutdoorfapplications. thefpackagefepoxyfcontainsfbothfuv-afandfuv-bfinhibi - torsftofreducefthefefectsfofflongftermfexposureftofdirectf sunlight. hlmp-ld15, hlmp-lm17, hlmp-lb17 precision optical performance red, green and blue 4mm standard oval leds data sheet features ? f wellfdefnedfspatialfradiationfpattern ? f highfbrightnessfmaterialf ? f availablefinfred,fgreenfandfbluefcolor. f f -f redfalingapf630mm f f f -f greenfinganf525nm f f -f bluefinganf470nm ? f superiorfresistanceftofmoisture ? f tintedfandfdifused benefts ? f viewingfanglefdesignedfforfwideffledfoffviewfapplica - tions ? f superiorfperformancefforfoutdoorfenvironments applications ? f fullfcolorfsigns ? f commercialfoutdoorfadvertising. caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details.
2 notes: 1.f thefluminousfintensityfisfmeasuredfonfthefmechanicalfaxisfofftheflampfpackage 2.f theftolerancefforfintensityflimitfisf15% 3.f thefopticalfaxisfisfcloselyfalignedfwithfthefpackagefmechanicalfaxis 4.f fthefdominantfwavelength,f d ,fisfderivedffromfthefchromaticityfdiagramfandfrepresentsfthefcolorfofftheflamp. device selection guide note: 1.f dimensionfinfmillimetersf(inches). 2.f tolerancefisf0.2mmfunlessfotherwisefnoted. 3.f forfinganfbluefandfgreenf(packagefb),fiffheat-sinkingfapplicationfisfrequired,fthefterminalfforfheatfsinkfisfanode. a b 6.3 0.248 9.65 0.380 3.7 0.146 1.25 0.049 21.0 0.827 min. max. epoxy meniscus cathode lead min. 1.0 0.038 2.9 0.114 0.40.1 0.0160.004 2.540.3 0.1000.012 0.450.10 0.0180.004 0.8 0.016 0.45 0.10 0.018 0.004 1.0min . 0.038 2.54 0.3 0.100 0.012 0.4 0.1 0.016 0.004 0.016 9.10 0.20 0.358 0.008 1.25 0.20 0.049 0.008 21.0min . 0.827 6.4 0.2 0.252 0.008 2.4 0.2 .094 .008 cathode lead 0.8max. epoxy meniscu s 3.87 0.2 0.152 0 .008 part number color and dominant wavelength d (nm) typ. luminous intensity iv (mcd) at 20 ma tinting type package drawing min max hlmp-ld15-mqtxx redf630 520 1500 red a hlmp-ld15-nrtxx redf630 680 1900 red a hlmp-lm17-sv0xx greenf525 1900 5500 green b hlmp-lb17-lp0xx bluef470 400 1150 blue b
3 notes: 1.f derateflinearlyfasfshownfinffiguref4fandffiguref8.f 2.f dutyffactorf30%,ffrequencyf1khz. 3.f dutyffactorf10%,ffrequencyf1khz. absolute maximum rating (t a = 25 o c) packaging options 00: bulk dd: ammo pack yy: flexi-bin, bulk zz: flexi-bin, ammo pack color bin options 0: no color bin limitation t: red color with max v f of 2.6v maximum intensity bin refer to device selection guide minimum intensity bin refer to device selection guide color d: 630nm red m: 525nm green b: 470nm blue package l: 4mm standard oval h l m p - - 1 x x x x xx l x part numbering system parameter red blue and green unit dcfforwardfcurrent f[1] 50 30 ma peakfforwardfcurrent 100 [2] 100 [3] ma powerfdissipation 130 116 mw reversefvoltagef 5f(i r f=f100f m a) 5f(i r f=f10f m a) v ledfjunctionftemperature 130 130 o c operatingftemperaturefrange -40ftof+100 -40ftof+85 o c storageftemperaturefrange -40ftof+100 -40ftof+100 o c note:fpleasefreferftofabf5337fforfcompletefinformationfaboutfpartfnumberingfsystem.
4 notes: 1.f forfoptionf-xxtxx,fv f fmaximumfisf2.6v.freferftofv f fbinftable. 2.f tolerancefforfeachfcolorfbinflimitfisff0.5fnmf 3.f thefdominantfwavelengthf d fisfderivedffromfthefchromaticityfdiagramfandfrepresentsfthefcolorfofftheflamp. 4.f forfalingapfred,fthermalfresistancefappliedftofledfjunctionftofcathodeflead,fandfforfinganfbluefandfgreen,fthermalfresistancefappliedftofledf junctionftofanodeflead. 5.f thefradiantfintensity,fi ef infwattsfperfsteradian,fmayfbeffoundffromfthefequationfi e f=fi v / vf wherefi vf isfthefluminousfintensityfinfcandelasfandf vf isfthef luminousfefcacyfinflumens/watt. 6.f e f=f j v f/fi f ffxfv f f,fwheref j v ffisfthefemittedfluminousffux,fi f ffisfelectricalfforwardfcurrentfandfv f fisfthefforwardfvoltage. electrical/optical characteristics parameter symbol min. typ. max. units test condition forwardfvoltage ffffredf f[1] fffffbluef fffffgreenf v f 2.0 2.8 2.8 2.3 3.2 3.3 2.6 3.85 3.85 v i f f=f20fma reversefvoltage fffffred fffffbluef fffffgreenf v r 5 5 5 v i r f=f100f m a i r f=f10f m a i r f=f10f m a peakfwavelength fffffred fffffblue fffffgreen peak 639 464 516 nm peakfoffwavelengthfoffspectralf distributionfatfi f f=f20fma dominantfwavelengthf [2,3] fffffred fffffgreen fffffblue d 622 520 460 630 525 470 634 540 480 nmf i f f=f20fma spectralfhalffwidth fffffred fffffbluef fffffgreen d 1/2 17 23 32 nm wavelengthfwidthfatfspectralfdistri - butionf 1 / 2 fpowerfpointfatf f i f f=f20fma capacitance fffffred fffffbluef fffffgreen c 40 65 64 pf v f f=f0,fff=f1fmhz thermalfresistancef [4] r q j-pin 240 o c/wf ledfjunction-to-pin luminousfefcacy f [5] fffffred fffffbluef fffffgreen v 155 75 520 lm/w emittedfluminousfpower/emittedf radiantfpower luminousfflux fffffred fffffgreen fffffblue j v 1300 3000 600 mlm i f f=f20fma luminousfefciency f[6] fffffred fffffgreen fffffblue e 30 50 10 lm/w luminousfflux/electricalfpower i f f=f20fma
5 figure 1. relative intensity vs. wavelength figure 2. forward current vs. forward voltage figure 3. relative luminous intensity vs. forward current figure 4. forward current vs. ambient temperature figure 5. relative intensity vs. wavelength figure 6. forward current vs. forward voltage. figure 7. relative luminous intensity vs. forward cur - rent. wavelength ? nm relative intensity 1.0 0.5 0 600 700 500 650 550 dc forward current - ma 0 0 forward voltage - v 2.5 40 30 0.5 1.5 60 3.0 10 20 50 1.0 2.0 relative intensity (normalized at 20 ma) 0 0 forward current - ma 40 2.0 1.5 1.0 0.5 20 50 2.5 10 30 wavelength - nm relative intensity 350 400 450 500 550 600 650 1.00 blue 0 0.80 0.60 0.40 0.20 green 0 5 10 15 20 25 30 35 0 1 2 3 4 forward voltage - v forward current - ma 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 5 10 15 20 25 30 dc forward current - ma relative luminous intensity (normalized at 20 ma) alingap red ingan blue and green 0 10 20 30 40 50 60 0 2 0 4 0 6 0 8 0 100 t a - ambient temperature - o c i f max - maximum forward current - ma
6 figure 10a. spatial radiation pattern C major axis for rgb figure 10b. spatial radiation pattern C minor axis for rgb 0 0.5 1 0 3 0 6 0 9 0 120 150 180 angular displacement - degrees normalized intensity 0 0.5 1 0 3 0 6 0 9 0 120 150 180 angular displacement - degrees normalized intensity figure 8. forward current vs. ambient temperature. figure 9. relative dominant wavelength vs. forward current 0.995 1.000 1.005 1.010 1.015 1.020 0 1 0 2 0 3 0 forward current, ma relative dominant wavelength green blue 0 5 10 15 20 25 30 35 0 2 0 4 0 6 0 8 0 100 t a - ambient temperature - o c i f - maximum forward current - ma
7 intensity bin limit table note:f 1.f allfbinfcategoriesfarefestablishedfforfclassifcationfoffproducts.fproductsfmayfnotfbefavail - ablefinfallfbinfcategories.fpleasefcontactfyourfavagoftechnologiesfrepresentativefforffurtherf information. 2.f vffbinftablefonlyfavailablefforfthosefalingapfredfdevicesfwithfoptionsfCxxtxx. vf bin table (v at 20ma) [2] blue color bin table green color bin table red color range tolerancefforfeachfbinflimitfisf0.05v. tolerancefforfeachfbinflimitfisff15% tolerancefforfeachfbinflimitfisff0.5nm bin intensity (mcd) at 20 ma min max l 400 520 m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 bin id min. max. va 2.0 2.2 vb 2.2 2.4 vc 2.4 2.6 bin min dom max dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 tolerancefforfeachfbinflimitfisff0.5nm min dom max dom xmin ymin xmax ymax 622 634 0.6904 0.3094 0.6945 0.2888 0.6726 0.3106 0.7135 0.2865 tolerancefforfeachfbinflimitfisff0.5nm bin min dom max dom xmin ymin xmax ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 2 524.0 528.0 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 3 528.0 532.0 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 5 536.0 540.0 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543
8 avago color bin on cie 1931 chromaticity diagram 0. 000 0. 200 0. 400 0. 600 0. 800 1. 000 0. 000 0. 100 0. 200 0. 300 0. 400 0. 500 0. 600 0. 700 0. 800 x y green 5 4 3 2 1 blue 5 4 3 2 1 red relative light output vs junction temperature 0.1 1 10 -40 -20 0 2 0 4 0 6 0 8 0 100 120 t j - junction temperature - c relative light output (normalized at tj = 25c) green blue red
alingap device cathode ingan device anode precautions: lead forming: ? f thefleadsfoffanfledflampfmayfbefpreformedforfcutftof lengthfpriorftofinsertionfandfsolderingfonfpcfboard. ? f forfbetterfcontrol,fitfisfrecommendedftofusefproperftoolf tofpreciselyfformfandfcutfthefleadsftofapplicableflengthf ratherfthanfdoingfitfmanually. ? f iffmanualfleadfcuttingfisfnecessary,fcutfthefleadsfafterf thef solderingf process.fthef solderf connectionf formsf af mechanicalfgroundfwhichfpreventsfmechanicalfstressf duef tof leadf cuttingf fromf travelingf intof ledf package.f thisfisfhighlyfrecommendedfforfhandfsolderfoperation,f asfthefexcessfleadflengthfalsofactsfasfsmallfheatfsink. soldering and handling: ? f carefmustfbeftakenfduringfpcbfassemblyfandfsolderingf processftofpreventfdamageftofthefledfcomponent.f ? f ledf componentf mayf bef efectivelyf handf solderedf tof pcb.f however,f itf isf onlyf recommendedf underf un - avoidablef circumstancesf suchf asf rework.f thef closestf manualfsolderingfdistancefoffthefsolderingfheatfsourcef (solderingfironsftip)ftofthefbodyfisf1.59mm.fsolderingf thef ledf usingf solderingf ironf tipf closerf thanf 1.59mmf mightfdamagefthefled. note:f 1.f pcbfwithfdiferentfsizefandfdesignf(componentfdensity)fwillfhavefdifer - entfheatfmassf(heatfcapacity).fthisfmightfcausefafchangefinftemperaturef experiencedfbyfthefboardfiffsamefwavefsolderingfsettingfisfused.fso,f itfisfrecommendedftofre-calibratefthefsolderingfproflefagainfbeforef loadingfafnewftypefoffpcb. 2.f avagoftechnologiesf highf brightnessf ledf aref usingf highf efciencyf ledfdiefwithfsinglefwirefbondfasfshownfbelow.fcustomerfisfadvisedf tof takef extraf precautionf duringf wavef solderingf tof ensuref thatf thef maximumfwaveftemperaturefdoesfnotfexceedf250cfandfthefsolderf contactftimefdoesfnotfexceedingf3sec.fover-stressingfthefledfduringf solderingfprocessfmightfcausefprematureffailureftofthefledfdueftof delamination. avago technologies led confguration 1.59mm ? f esdf precautionf mustf bef properlyf appliedf onf thef solderingfstationfandfpersonnelftofpreventfesdfdamagef tof thef ledf componentf thatf isf esdf sensitive.f dof referf tof avagof applicationf notef anf 1142f forf details.f thef solderingfironfusedfshouldfhavefgroundedftipftofensuref electrostaticfchargefisfproperlyfgrounded. ? f recommendedfsolderingfcondition: wave soldering [1, 2] manual solder dipping pre-heatftemperature 105fcfmax. - preheatftime 60fsecfmax - peakftemperature 250fcfmax. 260fcfmax. dwellftime 3fsecfmax. 5fsecfmax note:f 1)f abovefconditionsfrefersftofmeasurementfwithfthermocouplefmountedf atfthefbottomfoffpcb. 2)f itfisfrecommendedftofusefonlyfbottomfpreheatersfinforderftofreducef thermalfstressfexperiencedfbyfled. ? f wavefsolderingfparametersfmustfbefsetfandfmaintainedf accordingftofthefrecommendedftemperaturefandfdwellf time.fcustomerfisfadvisedftofperformfdailyfcheckfonfthef solderingfprofleftofensurefthatfitfisfalwaysfconformingf tofrecommendedfsolderingfconditions. f note:felectricalfconnectionfbetweenfbottomfsurfacefoffledfdiefandf thefleadfframefisfachievedfthroughfconductivefpaste. ? f anyf alignmentf fxturef thatf isf beingf appliedf duringf wavefsolderingfshouldfbeflooselyffttedfandfshouldfnotf applyf weightf orf forcef onf led.f nonf metalf materialf isf recommendedfasfitfwillfabsorbflessfheatfduringfwavef solderingfprocess. ? f atf elevatedf temperature,f ledf isf moref susceptiblef tof mechanicalfstress.ftherefore,fpcbfmustfallowedftofcoolf downf tof roomf temperaturef priorf tof handling,f whichf includesfremovalfoffalignmentffxtureforfpallet. ? f iffpcbfboardfcontainsfbothfthroughfholef(th)fledfandf otherfsurfacefmountfcomponents,fitfisfrecommendedf thatf surfacef mountf componentsf bef solderedf onf thef topfsidefoffthefpcb.fiffsurfacefmountfneedftofbefonfthef bottomf side,f thesef componentsf shouldf bef solderedf usingfrefowfsolderingfpriorftofinsertionfthefthfled. ? f recommendedf pcf boardf platedf throughf holesf (pth)f sizefforfledfcomponentfleads. led component lead size diagonal plated through hole diameter 0.45fxf0.45fmm (0.018xf0.018finch) 0.636fmm (0.025finch) 0.98ftof1.08fmm (0.039ftof0.043finch) 0.50fxf0.50fmm (0.020xf0.020finch) 0.707fmm (0.028finch) 1.05ftof1.15fmm (0.041ftof0.045finch) ? f over-sizingf thef pthf canf leadf tof twistedf ledf afterf clinching.fonfthefotherfhandfunderfsizingfthefpthfcanf causefdifcultyfinsertingfthefthfled. f referftofapplicationfnotef5334fforfmorefinformationfaboutfsolderingf andfhandlingfoffhighfbrightnessfthfledflamps.
10 example of wave soldering temperature profle for th led ammo packs drawing note:fthefammo-packsfdrawingfisfapplicablefforfpackagingfoptionfCddf&f-zzfandfregardlessfstandoffforfnon-standoff 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force.
11 packaging box for ammo packs label on this side of box from left side of box adhesive tape must be ? facing upwards. anode lead leaves the box first. note:fforfinganfdevice,fthefammofpackfpackagingfboxfcontainfesdflogo packaging label (i)f avagofmotherflabel:f(availablefonfpackagingfboxfoffammofpackfandfshippingfbox) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. obsoletes av01-0293en av02-0364en - september 5, 2008 disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, main - tenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its sup - pliers, for all loss, damage, expense or liability in connection with such use. acronyms and defnition: bin:f (i)f colorfbinfonlyforfvffbinfonly f (applicablefforfpartfnumberfwithfcolorfbinsfbutfwithoutf vffbinforfpartfnumberfwithfvffbinsfandfnofcolorfbin) orfffffffff (ii)f colorfbinfincorporatedfwithfvffbin f (applicablef forf partf numberf thatf havef bothf colorf binf andfvffbin) (ii)f avagofbabyflabelf(onlyfavailablefonfbulkfpackaging) example: (i)f colorfbinfonlyforfvffbinfonly f bin:f2f(representfcolorfbinf2fonly) f bin:fvbf(representfvffbinfvbfonly) (ii)f colorfbinfincorporatefwithfvffbin f bin:f2vbff f f vb:fvffbinfvb f f 2:ffcolorfbinf2fonly ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l

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